Morphology of copper deposits obtained by metallic electrodeposition

Autores
González Mercado, Griselda V.; González , Carlos J.; Oliva , Marcos I.; Brunetti, Verónica; Eimer, Griselda A.
Año de publicación
2015
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
Electrochemical deposition of copper from copper nitrate aqueous electrolyte on graphite substrate was investigated at current densities between 0.03 mA/cm2 - 1.36 mA/cm2 and in the voltage range of 3 V to 15 V. The surface morphology and elemental composition of the resultant deposit were characterized by electron microprobe analysis (EMPA). These images illustrate the influence of current density on the shape of copper electrodeposited on the electrode surface. Rods, polyhedral bodies, pentagonal pyramids, dendritics, spiked spheres or cauliflower-like shapes are observed depending on the electrodeposition conditions.
Fil: González Mercado, Griselda V. Universidad Tecnológica Nacional. Facultad Regional Córdoba. Centro de Investigación y Transferencia en Ingeniería Química Ambiental; Argentina.
Fil: González, Carlos J. Universidad Tecnológica Nacional. Facultad Regional Córdoba. Centro de Investigación y Transferencia en Ingeniería Química Ambiental; Argentina.
Fil: Oliva, Marcos I. Universidad Nacional de Córdoba. Facultad de Matemática, Astronomía, Física y Computación. Instituto de Física Enrique Gaviola. Grupo de Ciencia de Materiales; Argentina.
Fil: Oliva, Marcos I. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina.
Fil: Brunetti, Verónica. Universidad Nacional de Córdoba. Instituto de Investigaciones en Físico-Química de Córdoba; Argentina.
Fil: Brunetti, Verónica. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina.
Fil: Eimer, Griselda A. Universidad Tecnológica Nacional. Facultad Regional Córdoba. Centro de Investigación y Tecnología Química, Argentina.
Peer Reviewed
Fuente
Procedia Materials Science 8: 635 – 640 (2015).
Materia
EMPA
Superficial morphology
Copper
Nivel de accesibilidad
acceso abierto
Condiciones de uso
Attribution-NonCommercial-NoDerivatives 4.0 International
Repositorio
Repositorio Institucional Abierto (UTN)
Institución
Universidad Tecnológica Nacional
OAI Identificador
oai:ria.utn.edu.ar:20.500.12272/14025
Acceder
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network_acronym_str RIAUTN
repository_id_str a
network_name_str Repositorio Institucional Abierto (UTN)
spelling Morphology of copper deposits obtained by metallic electrodepositionGonzález Mercado, Griselda V.González , Carlos J.Oliva , Marcos I.Brunetti, VerónicaEimer, Griselda A.EMPASuperficial morphologyCopperElectrochemical deposition of copper from copper nitrate aqueous electrolyte on graphite substrate was investigated at current densities between 0.03 mA/cm2 - 1.36 mA/cm2 and in the voltage range of 3 V to 15 V. The surface morphology and elemental composition of the resultant deposit were characterized by electron microprobe analysis (EMPA). These images illustrate the influence of current density on the shape of copper electrodeposited on the electrode surface. Rods, polyhedral bodies, pentagonal pyramids, dendritics, spiked spheres or cauliflower-like shapes are observed depending on the electrodeposition conditions.Fil: González Mercado, Griselda V. Universidad Tecnológica Nacional. Facultad Regional Córdoba. Centro de Investigación y Transferencia en Ingeniería Química Ambiental; Argentina.Fil: González, Carlos J. Universidad Tecnológica Nacional. Facultad Regional Córdoba. Centro de Investigación y Transferencia en Ingeniería Química Ambiental; Argentina.Fil: Oliva, Marcos I. Universidad Nacional de Córdoba. Facultad de Matemática, Astronomía, Física y Computación. Instituto de Física Enrique Gaviola. Grupo de Ciencia de Materiales; Argentina.Fil: Oliva, Marcos I. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina.Fil: Brunetti, Verónica. Universidad Nacional de Córdoba. Instituto de Investigaciones en Físico-Química de Córdoba; Argentina.Fil: Brunetti, Verónica. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina.Fil: Eimer, Griselda A. Universidad Tecnológica Nacional. Facultad Regional Córdoba. Centro de Investigación y Tecnología Química, Argentina.Peer ReviewedElsevier2025-10-23T19:14:59Z2015info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articulopdfapplication/pdfInternational Congress of Science and Technology of Metallurgy and Materials, SAM -CONAMET 2013.https://hdl.handle.net/20.500.12272/14025https://doi.org/10.1016/j.mspro.2015.04.119Procedia Materials Science 8: 635 – 640 (2015).reponame:Repositorio Institucional Abierto (UTN)instname:Universidad Tecnológica Nacionalenginfo:eu-repo/semantics/openAccessAttribution-NonCommercial-NoDerivatives 4.0 Internationalhttp://creativecommons.org/licenses/by-nc-nd/4.0/González Mercado, Griselda V.; González, Carlos J., Oliva, Marcos I., Brunetti, Verónica; Eimer, Griselda A.https://creativecommons.org/licenses/by-nc-nd/4.0/2026-09-24T12:47:25Zoai:ria.utn.edu.ar:20.500.12272/14025instacron:UTNInstitucionalhttp://ria.utn.edu.ar/Universidad públicaNo correspondehttp://ria.utn.edu.ar/oaigestionria@rec.utn.edu.ar; fsuarez@rec.utn.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:a2026-09-24 12:47:27.285Repositorio Institucional Abierto (UTN) - Universidad Tecnológica Nacionalfalse
dc.title.none.fl_str_mv Morphology of copper deposits obtained by metallic electrodeposition
title Morphology of copper deposits obtained by metallic electrodeposition
spellingShingle Morphology of copper deposits obtained by metallic electrodeposition
González Mercado, Griselda V.
EMPA
Superficial morphology
Copper
title_short Morphology of copper deposits obtained by metallic electrodeposition
title_full Morphology of copper deposits obtained by metallic electrodeposition
title_fullStr Morphology of copper deposits obtained by metallic electrodeposition
title_full_unstemmed Morphology of copper deposits obtained by metallic electrodeposition
title_sort Morphology of copper deposits obtained by metallic electrodeposition
dc.creator.none.fl_str_mv González Mercado, Griselda V.
González , Carlos J.
Oliva , Marcos I.
Brunetti, Verónica
Eimer, Griselda A.
author González Mercado, Griselda V.
author_facet González Mercado, Griselda V.
González , Carlos J.
Oliva , Marcos I.
Brunetti, Verónica
Eimer, Griselda A.
author_role author
author2 González , Carlos J.
Oliva , Marcos I.
Brunetti, Verónica
Eimer, Griselda A.
author2_role author
author
author
author
dc.subject.none.fl_str_mv EMPA
Superficial morphology
Copper
topic EMPA
Superficial morphology
Copper
dc.description.none.fl_txt_mv Electrochemical deposition of copper from copper nitrate aqueous electrolyte on graphite substrate was investigated at current densities between 0.03 mA/cm2 - 1.36 mA/cm2 and in the voltage range of 3 V to 15 V. The surface morphology and elemental composition of the resultant deposit were characterized by electron microprobe analysis (EMPA). These images illustrate the influence of current density on the shape of copper electrodeposited on the electrode surface. Rods, polyhedral bodies, pentagonal pyramids, dendritics, spiked spheres or cauliflower-like shapes are observed depending on the electrodeposition conditions.
Fil: González Mercado, Griselda V. Universidad Tecnológica Nacional. Facultad Regional Córdoba. Centro de Investigación y Transferencia en Ingeniería Química Ambiental; Argentina.
Fil: González, Carlos J. Universidad Tecnológica Nacional. Facultad Regional Córdoba. Centro de Investigación y Transferencia en Ingeniería Química Ambiental; Argentina.
Fil: Oliva, Marcos I. Universidad Nacional de Córdoba. Facultad de Matemática, Astronomía, Física y Computación. Instituto de Física Enrique Gaviola. Grupo de Ciencia de Materiales; Argentina.
Fil: Oliva, Marcos I. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina.
Fil: Brunetti, Verónica. Universidad Nacional de Córdoba. Instituto de Investigaciones en Físico-Química de Córdoba; Argentina.
Fil: Brunetti, Verónica. Consejo Nacional de Investigaciones Científicas y Técnicas; Argentina.
Fil: Eimer, Griselda A. Universidad Tecnológica Nacional. Facultad Regional Córdoba. Centro de Investigación y Tecnología Química, Argentina.
Peer Reviewed
description Electrochemical deposition of copper from copper nitrate aqueous electrolyte on graphite substrate was investigated at current densities between 0.03 mA/cm2 - 1.36 mA/cm2 and in the voltage range of 3 V to 15 V. The surface morphology and elemental composition of the resultant deposit were characterized by electron microprobe analysis (EMPA). These images illustrate the influence of current density on the shape of copper electrodeposited on the electrode surface. Rods, polyhedral bodies, pentagonal pyramids, dendritics, spiked spheres or cauliflower-like shapes are observed depending on the electrodeposition conditions.
publishDate 2015
dc.date.none.fl_str_mv 2015
2025-10-23T19:14:59Z
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv International Congress of Science and Technology of Metallurgy and Materials, SAM -CONAMET 2013.
https://hdl.handle.net/20.500.12272/14025
https://doi.org/10.1016/j.mspro.2015.04.119
identifier_str_mv International Congress of Science and Technology of Metallurgy and Materials, SAM -CONAMET 2013.
url https://hdl.handle.net/20.500.12272/14025
https://doi.org/10.1016/j.mspro.2015.04.119
dc.language.none.fl_str_mv eng
language eng
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
Attribution-NonCommercial-NoDerivatives 4.0 International
http://creativecommons.org/licenses/by-nc-nd/4.0/
González Mercado, Griselda V.; González, Carlos J., Oliva, Marcos I., Brunetti, Verónica; Eimer, Griselda A.
https://creativecommons.org/licenses/by-nc-nd/4.0/
eu_rights_str_mv openAccess
rights_invalid_str_mv Attribution-NonCommercial-NoDerivatives 4.0 International
http://creativecommons.org/licenses/by-nc-nd/4.0/
González Mercado, Griselda V.; González, Carlos J., Oliva, Marcos I., Brunetti, Verónica; Eimer, Griselda A.
https://creativecommons.org/licenses/by-nc-nd/4.0/
dc.format.none.fl_str_mv pdf
application/pdf
dc.publisher.none.fl_str_mv Elsevier
publisher.none.fl_str_mv Elsevier
dc.source.none.fl_str_mv Procedia Materials Science 8: 635 – 640 (2015).
reponame:Repositorio Institucional Abierto (UTN)
instname:Universidad Tecnológica Nacional
reponame_str Repositorio Institucional Abierto (UTN)
collection Repositorio Institucional Abierto (UTN)
instname_str Universidad Tecnológica Nacional
repository.name.fl_str_mv Repositorio Institucional Abierto (UTN) - Universidad Tecnológica Nacional
repository.mail.fl_str_mv gestionria@rec.utn.edu.ar; fsuarez@rec.utn.edu.ar
_version_ 1877230937307086848
score 13.24418

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