Analytic circuit model for thermal drying behavior of electronic inks

Autores
Palumbo, Felix
Año de publicación
2023
Idioma
inglés
Tipo de recurso
artículo
Estado
versión publicada
Descripción
Understanding the sintering process of conductive inks is a fundamental step in the development of sensors. The intrinsic properties (such as thermal conductivity, resistivity, thermal coefficient, among others) of the printed devices do not correspond to those of the bulk materials. In the field of biosensors porosity plays a predominant role, since it defines the difference between the geometric area of the working electrode and its electrochemical surface area. The analysis reported so far in the literature on the sintering of inks are based on their DC characterization. In this work, the shape and distribution of the nanoparticles that make up the silver ink have been studied employing a transmission electron microscopy. Images of the printed traces have been obtained through a scanning electron microscope at different sintering times, allowing to observe how the material decreases its porosity over time. These structural changes were supported through electrical measurements of the change in the trace impedance as a function of drying time. The resistivity and thermal coefficient of the printed tracks were analyzed and compared with the values of bulk silver. Finally, this work proposes an analytical circuit model of the drying behavior of the ink based on AC characterization at different frequencies. The characterization considers an initial time when the spheric nanoparticles are still surrounded by the capping agent until the conductive trace is obtained. This model can estimate the characteristics that the printed devices would have, whether they are used as biosensors (porous material) or as interconnections (compact material) in printed electronics
Fil: UIDI-CONICET Universidad Tecnológica Nacional, Buenos Aires, Argentina
Peer Reviewed
Materia
tintas
Nivel de accesibilidad
acceso abierto
Condiciones de uso
2024-04-03T20:53:44Z
Repositorio
Repositorio Institucional Abierto (UTN)
Institución
Universidad Tecnológica Nacional
OAI Identificador
oai:ria.utn.edu.ar:20.500.12272/10298
Acceder
id RIAUTN_52702bbf48f722d4e56544230d9b3586
oai_identifier_str oai:ria.utn.edu.ar:20.500.12272/10298
network_acronym_str RIAUTN
repository_id_str a
network_name_str Repositorio Institucional Abierto (UTN)
spelling Analytic circuit model for thermal drying behavior of electronic inksPalumbo, FelixtintasUnderstanding the sintering process of conductive inks is a fundamental step in the development of sensors. The intrinsic properties (such as thermal conductivity, resistivity, thermal coefficient, among others) of the printed devices do not correspond to those of the bulk materials. In the field of biosensors porosity plays a predominant role, since it defines the difference between the geometric area of the working electrode and its electrochemical surface area. The analysis reported so far in the literature on the sintering of inks are based on their DC characterization. In this work, the shape and distribution of the nanoparticles that make up the silver ink have been studied employing a transmission electron microscopy. Images of the printed traces have been obtained through a scanning electron microscope at different sintering times, allowing to observe how the material decreases its porosity over time. These structural changes were supported through electrical measurements of the change in the trace impedance as a function of drying time. The resistivity and thermal coefficient of the printed tracks were analyzed and compared with the values of bulk silver. Finally, this work proposes an analytical circuit model of the drying behavior of the ink based on AC characterization at different frequencies. The characterization considers an initial time when the spheric nanoparticles are still surrounded by the capping agent until the conductive trace is obtained. This model can estimate the characteristics that the printed devices would have, whether they are used as biosensors (porous material) or as interconnections (compact material) in printed electronicsFil: UIDI-CONICET Universidad Tecnológica Nacional, Buenos Aires, ArgentinaPeer Reviewed2024-04-03T20:53:44Z2024-04-03T20:53:44Z2023-01-23info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionhttp://purl.org/coar/resource_type/c_6501info:ar-repo/semantics/articuloplainapplication/pdfhttp://hdl.handle.net/20.500.12272/1029810.3389/felec.2022.1060197enginfo:eu-repo/semantics/openAccess2024-04-03T20:53:44Zhttp://creativecommons.org/publicdomain/zero/1.0/CC0 1.0 Universalconicetinvestigacionreponame:Repositorio Institucional Abierto (UTN)instname:Universidad Tecnológica Nacional2026-09-24T12:48:56Zoai:ria.utn.edu.ar:20.500.12272/10298instacron:UTNInstitucionalhttp://ria.utn.edu.ar/Universidad públicaNo correspondehttp://ria.utn.edu.ar/oaigestionria@rec.utn.edu.ar; fsuarez@rec.utn.edu.arArgentinaNo correspondeNo correspondeNo correspondeopendoar:a2026-09-24 12:48:58.031Repositorio Institucional Abierto (UTN) - Universidad Tecnológica Nacionalfalse
dc.title.none.fl_str_mv Analytic circuit model for thermal drying behavior of electronic inks
title Analytic circuit model for thermal drying behavior of electronic inks
spellingShingle Analytic circuit model for thermal drying behavior of electronic inks
Palumbo, Felix
tintas
title_short Analytic circuit model for thermal drying behavior of electronic inks
title_full Analytic circuit model for thermal drying behavior of electronic inks
title_fullStr Analytic circuit model for thermal drying behavior of electronic inks
title_full_unstemmed Analytic circuit model for thermal drying behavior of electronic inks
title_sort Analytic circuit model for thermal drying behavior of electronic inks
dc.creator.none.fl_str_mv Palumbo, Felix
author Palumbo, Felix
author_facet Palumbo, Felix
author_role author
dc.subject.none.fl_str_mv tintas
topic tintas
dc.description.none.fl_txt_mv Understanding the sintering process of conductive inks is a fundamental step in the development of sensors. The intrinsic properties (such as thermal conductivity, resistivity, thermal coefficient, among others) of the printed devices do not correspond to those of the bulk materials. In the field of biosensors porosity plays a predominant role, since it defines the difference between the geometric area of the working electrode and its electrochemical surface area. The analysis reported so far in the literature on the sintering of inks are based on their DC characterization. In this work, the shape and distribution of the nanoparticles that make up the silver ink have been studied employing a transmission electron microscopy. Images of the printed traces have been obtained through a scanning electron microscope at different sintering times, allowing to observe how the material decreases its porosity over time. These structural changes were supported through electrical measurements of the change in the trace impedance as a function of drying time. The resistivity and thermal coefficient of the printed tracks were analyzed and compared with the values of bulk silver. Finally, this work proposes an analytical circuit model of the drying behavior of the ink based on AC characterization at different frequencies. The characterization considers an initial time when the spheric nanoparticles are still surrounded by the capping agent until the conductive trace is obtained. This model can estimate the characteristics that the printed devices would have, whether they are used as biosensors (porous material) or as interconnections (compact material) in printed electronics
Fil: UIDI-CONICET Universidad Tecnológica Nacional, Buenos Aires, Argentina
Peer Reviewed
description Understanding the sintering process of conductive inks is a fundamental step in the development of sensors. The intrinsic properties (such as thermal conductivity, resistivity, thermal coefficient, among others) of the printed devices do not correspond to those of the bulk materials. In the field of biosensors porosity plays a predominant role, since it defines the difference between the geometric area of the working electrode and its electrochemical surface area. The analysis reported so far in the literature on the sintering of inks are based on their DC characterization. In this work, the shape and distribution of the nanoparticles that make up the silver ink have been studied employing a transmission electron microscopy. Images of the printed traces have been obtained through a scanning electron microscope at different sintering times, allowing to observe how the material decreases its porosity over time. These structural changes were supported through electrical measurements of the change in the trace impedance as a function of drying time. The resistivity and thermal coefficient of the printed tracks were analyzed and compared with the values of bulk silver. Finally, this work proposes an analytical circuit model of the drying behavior of the ink based on AC characterization at different frequencies. The characterization considers an initial time when the spheric nanoparticles are still surrounded by the capping agent until the conductive trace is obtained. This model can estimate the characteristics that the printed devices would have, whether they are used as biosensors (porous material) or as interconnections (compact material) in printed electronics
publishDate 2023
dc.date.none.fl_str_mv 2023-01-23
2024-04-03T20:53:44Z
2024-04-03T20:53:44Z
dc.type.none.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
http://purl.org/coar/resource_type/c_6501
info:ar-repo/semantics/articulo
format article
status_str publishedVersion
dc.identifier.none.fl_str_mv http://hdl.handle.net/20.500.12272/10298
10.3389/felec.2022.1060197
url http://hdl.handle.net/20.500.12272/10298
identifier_str_mv 10.3389/felec.2022.1060197
dc.language.none.fl_str_mv eng
language eng
dc.rights.none.fl_str_mv info:eu-repo/semantics/openAccess
2024-04-03T20:53:44Z
http://creativecommons.org/publicdomain/zero/1.0/
CC0 1.0 Universal
conicet
investigacion
eu_rights_str_mv openAccess
rights_invalid_str_mv 2024-04-03T20:53:44Z
http://creativecommons.org/publicdomain/zero/1.0/
CC0 1.0 Universal
conicet
investigacion
dc.format.none.fl_str_mv plain
application/pdf
dc.source.none.fl_str_mv reponame:Repositorio Institucional Abierto (UTN)
instname:Universidad Tecnológica Nacional
reponame_str Repositorio Institucional Abierto (UTN)
collection Repositorio Institucional Abierto (UTN)
instname_str Universidad Tecnológica Nacional
repository.name.fl_str_mv Repositorio Institucional Abierto (UTN) - Universidad Tecnológica Nacional
repository.mail.fl_str_mv gestionria@rec.utn.edu.ar; fsuarez@rec.utn.edu.ar
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score 13.265058

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